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Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

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Yong Liu

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Pages: 612pages
Temps de lecture: 22heures

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Focusing on power electronic packaging, the book provides a comprehensive exploration of design, assembly, reliability, and failure analysis. It emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for understanding the complexities and innovations in this specialized field.

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Power Electronic Packaging, Yong Liu

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Année de publication: 2014
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Titre: Power Electronic Packaging
Sous-titre: Design, Assembly Process, Reliability and Modeling
Langue: Anglais
Auteurs: Yong Liu
Éditeur: Springer New York
Publié: 2014
Format: souple
Pages: 612
ISBN13: 9781489987976
Mots clés: Nature, Animaux, La nature, Électrotechnique
Évaluation: 5 sur 5
Description: Focusing on power electronic packaging, the book provides a comprehensive exploration of design, assembly, reliability, and failure analysis. It emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for understanding the complexities and innovations in this specialized field.