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Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

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Yong Liu

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Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.

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Power Electronic Packaging, Yong Liu

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Année de publication: 2012
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Titre: Power Electronic Packaging
Sous-titre: Design, Assembly Process, Reliability and Modeling
Langue: Anglais
Auteurs: Yong Liu
Éditeur: Springer-Verlag GmbH
Publié: 2012
Format: rigide
ISBN13: 9781461410522
Mots clés: Nature, Animaux, La nature, Électrotechnique
Évaluation: 5 sur 5
Description: Focusing on power electronic packaging, this comprehensive guide explores key topics such as design, assembly, reliability, and failure analysis. It also emphasizes materials selection and incorporates advanced simulation and modeling techniques, making it an essential resource for professionals and researchers in the field.