Paramètres
- 692pages
- 25 heures de lecture
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This book serves as a valuable reference for reliability professionals and a text for advanced undergraduate or graduate students, introducing the extensive reliability literature related to microelectronic and electronic devices. It addresses chip and packaging level failures, linking them to atomic mechanisms and models that explain degradation, alongside the statistical analysis of lifetime data. Key failure mechanisms discussed include electromigration, dielectric radiation damage, and mechanical failures of contacts and solder joints. A central theme is the relationship between product defects, yield, and reliability, emphasizing their role in failures and methods for experimental exposure. Readers will enhance their understanding of failure mechanisms in electronic materials and devices, develop skills in the mathematical handling of reliability data, and gain insights into future technology trends and associated reliability challenges. Key features include discussions on reliability and failure at both chip and packaging levels, the impact of defects on yield and reliability, a tutorial on reliability mathematics, and a focus on various failure mechanisms and defect detection methods.
Achat du livre
Reliability and Failure of Electronic Materials and Devices, Milton Ohring
- Langue
- Année de publication
- 1998
- product-detail.submit-box.info.binding
- (souple),
- État du livre
- Bon
- Prix
- 135,99 €
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- Titre
- Reliability and Failure of Electronic Materials and Devices
- Langue
- Anglais
- Auteurs
- Milton Ohring
- Éditeur
- Academic Press
- Publié
- 1998
- Format
- souple
- Pages
- 692
- ISBN10
- 149330173X
- ISBN13
- 9781493301737
- Séries
- Mots clés
- Technologie & Ingénierie, Science et Mathématiques, Mathématiques, Ingénierie, Électronique
- Description
- This book serves as a valuable reference for reliability professionals and a text for advanced undergraduate or graduate students, introducing the extensive reliability literature related to microelectronic and electronic devices. It addresses chip and packaging level failures, linking them to atomic mechanisms and models that explain degradation, alongside the statistical analysis of lifetime data. Key failure mechanisms discussed include electromigration, dielectric radiation damage, and mechanical failures of contacts and solder joints. A central theme is the relationship between product defects, yield, and reliability, emphasizing their role in failures and methods for experimental exposure. Readers will enhance their understanding of failure mechanisms in electronic materials and devices, develop skills in the mathematical handling of reliability data, and gain insights into future technology trends and associated reliability challenges. Key features include discussions on reliability and failure at both chip and packaging levels, the impact of defects on yield and reliability, a tutorial on reliability mathematics, and a focus on various failure mechanisms and defect detection methods.